激光切割陶瓷

切割630微米厚的熟陶瓷基材

激光可以进行连续,闭合的切割.例如:进行外形切割时,激光加工的最大特点就是高品质边缘的优良结构。

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乐普科(天津)光电有限公司
天津华苑环外海泰发展六道6号 K1-6-202

Tel.:

+86 22 23785318 23785328

E-Mail:

乐普科（天津）光电有限公司天津华苑环外海泰发展六道6号，海泰绿色产业基地K1－6－202 300384 Tel: +86 22 23785318 23785328 Fax: +86 22 23785398

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