New LPKF systems and procedures at the electronica 2012
The electronica fair is one of the most important trade fairs for LPKF Laser & Electronics AG. Recently LPKF obtained admission to the TecDAX and will present itself with innovative developments in Munich.
The LPKF MicroLine 1820 P responds to the growing demand for high-performance UV laser cutting systems. These systems are used to separate rigid, rigid-flex and flexible PCBs from larger panels or to cut cover layers. Since no significant mechanical or thermal influences acting on the substrates, cutting-edge can be laid directly near sensitive cuircuit tracks or components. The new system offers twice the cutting speed and an optional bulkhead, which allows a larger production area inside the system. The new laser system will be available in the second quarter of 2013.
LDS technology is also represented at the booth. LDS technology (Laser Direct Structuring) creates three-dimensional circuitry structures on a plastic component. A subsequent process covers the structured area with a metal coating - usually copper, followed by a nickel / gold finish. LPKF will show the laser system LPKF Fusion3D 1100, flanked by two innovations: the well-known ProtoPaint finish was developed, so that a single coating without thermal hardening leads to a reliable activatable layer. For the chemical metallization the LPKF ProtoPlate cabinet with a newly designed box is on the booth. The necessary components for metallization are supplied ready-made and can be used without any knowledge of chemistry.
The well-known PCB prototyping systems must not be missing: they are a key product From the idea to the finished PCB it takes only one day using this systems. LPKF presents the top-level mechanical circuit board plotter, the ProtoMat S103. The SMT systems ProtoPrint S (solder paste printing), ProtoPlace S (pick & place) and the reflow oven ProtoFlow S can also be inspected..
The ProtoLaser U3 was presented a year ago at productronica in Munich. As a universal top laser system it is able to structure, cut or drill laminated PCB materials in the laboratory or for small production series. In addition, it is suitable for processing ceramics, TCO / ITO coatings or LTCC, or to cut foils. It reaches a pitch of 75 microns / 100 microns (ceramics / laminated substrates) and produces geometries which are very close to the ideal layout and are equal to series production.
LPKF is the world leader for StencilLasers systems used for cutting solder paste stencils,. The StencilLasers are continuously further developed and optimized. The presented top system LPKF StencilLaser G 6080 can be used also for a new range of application: with a sophisticated process the current LPKF StencilLasers can now also manufacture stepped stencils (step-down). Step stencils are required to contact fine components on the circuit boards, if large portions of solder paste could lead to undesirable short circuits.
The LPKF StencilLaser can be controlled so precisely, so that defined layer thicknesses can be removed with an acceptable roughness. This laser procedure replaces the previous high precision milling and extends the range of use considerably. Technical documents for this new process are available at the electronica.
More power and a safety bulkhead: The UV laser cutting system LPKF Microline 1820 is available from 2nd quarter 2013
The Swiss army knife in the electronics lab: the ProtoLaser U3 can structure and cur laminated substrates, ceramics and a variety of other materials.
The ProtoPlate system consists of this newly developed cabinet and easy-to-use prefabricated metallizing components.
Directly from the StencilLaser: the dark areas show a precise reducing of the plate thickness for contacting of very fine components
About LPKFLPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
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