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LPKF Shows Laser Application Highlights at productronica

30/Sep/2015

 
LPKF has made a name for itself in laser systems for micro material processing. At productronica, the company will present its new laser systems and production processes at stand 303 in hall B3. Some of LPKF’s new additions include a picosecond laser in a new price-to-performance class and updated versions of the familiar ProtoLaser.

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Three new laboratory lasers and additional production systems - the latest results from LPKF’s R&D department.
LPKF’s R&D departments have done a good job. Their development and production lasers will be ready for presentation just in time for the productronica trade show, to be held in Munich on November 10–13, 2015.

The presentation highlights will be three new ProtoLasers - specially designed for laser micro material processing in the development lab. The ProtoLaser S4 works with a green laser to yield a number of advantages for circuit board processing: faster PCB manufacturing, gentle substrate treatment, and easy-to-use software optimized for this application. The ProtoLaser U4, the successor to the best-selling ProtoLaser U3, will also make its debut at productronica. The new system measures the energy input at the material level, comes with a fast, high-resolution vision system, and can process delicate substrates through additional energy stability in the low energy range.

The ProtoLaser R has been optimized for cold processing of thin films. This system utilizes a picosecond laser source with extremely short laser pulses to enable processing without producing heat affected zones.

Another highlight of the LPKF presentation will be the 3D LDS technology. This technology is used to apply conductive metal structures to three-dimensional plastic bodies. The LPKF Fusion3D 1200 laser structurer features a fast rotary table with two nests. There is room for up to three laser processing heads operating simultaneously in the processing area. The demonstration system features the latest generation of processing heads. The heads can be designed for extreme speed (for up to 25% higher productivity) or high precision.

LPKF will not only introduce new products but also present new laser processes such as the automated, networked laser depaneling process integrated into the SMT line and large-stencil processing. At stand 303 in hall B3, visitors will be treated to a number of exhibits and can have their questions answered by application specialists.
 
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LPKF Laser & Electronics AG

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