Garbsen, November 2007 - First place in this year’s MID Industry Award goes to the T4T coupling housing for digital model railways; developed using the LPKF-LDS Process. Applications for the second and third place companies were also developed using the LPKF-LDS Process. The coupling housing is part of a fully automated digital pairing system and is structured and metallized by LaserMicronics GmbH industry services.
The LPKF-LDS Process (Laser Direct Structuring) developed by LPKF Laser & Electronics AG integrates high resolution PCB layouts directly on 3D Molded Interconnect Devices (MID). It is used especially for series production in telecommunication and automotive electronics.
Coupling housing for digital model railways
Press > Press Releases > 2007
