Through-hole plating systems for the production of prototype and small batch production
Double sided and multilayer boards can quickly and easily be plated through. The selectable Reverse-Pulse Plating creates a uniform distribution of conductive copper, which allows for smooth plating of an unlimited number of holes as small as 0.2 mm (8 mils).
Both systems offer the same functionalities to a great extent, but are developed for the processing of different board sizes. Additionally, the Contac RS offers a heated tank for chemical tin plating for optimal soldering of through-hole plated circuit boards as well as oxidation protection.
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