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Through-hole plating systems for the production of prototype and small batch production

30/Apr/2007
Garbsen, April 2007 – The LPKF Contac RS and MiniContac RS are through-hole plating systems specially developed for the professional production of prototype and small batch production printed circuit boards.  The systems are ideal for small runs and tight work areas.
 
Double sided and multilayer boards can quickly and easily be plated through. The selectable Reverse-Pulse Plating creates a uniform distribution of conductive copper, which allows for smooth plating of an unlimited number of holes as small as 0.2 mm (8 mils).

Both systems offer the same functionalities to a great extent, but are developed for the processing of different board sizes.  Additionally, the Contac RS offers a heated tank for chemical tin plating for optimal soldering of through-hole plated circuit boards as well as oxidation protection.
 
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LPKF Laser & Electronics AG

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