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Focus on Micromaterial Processing/
LPKF presents three world premieres at productronica

15/Oct/2009
The LPKF Laser & Electronics AG of Garbsen/Germany operates several divisions covering a broad spectrum of requirements in mi-cromaterial processing. The globally active laser specialist is show-casing new trends and systems at productronica.
 
“In today’s difficult economic situation, LPKF has an invaluable advantage thanks to its broad base. Our core competence in laser micromaterial processing flows into all systems produced by our corporate divisions and is reflected in a continuous stream of new and further developments.” LPKF CEO Dr. Ingo Bretthauer stated his satisfaction with business development to date during 2009.

At this year's productronica LPKF, in hall B3, stand 105, will be showcasing its well-known techniques and processes for in-house Rapid PCB Prototyping using circuit board plotters, SMD assembly and reflow ovens. LPKF’s flagship, the LPKF ProtolaserS for the structuring of laminated and non-laminated PCB materials is in action on the stand. Several prototyping machines have undergone comprehensive further development and are now on display for the first time. 

The ‘E’ in the new “E-series”, stands for both Economy and Education. The E-series waives all non-essential functions and represents the very affordable entry into professional prototyping and small series production. The first systems in the E-series are the LPKF ProtoPrint E (stencil printing), the manual SMD assembly system LPKF ProtoPlace E and the LPKF ProtoFlow E reflow oven. All products can handle PCBs of sizes up to 160 x 200 mm.

A second world premiere involves PCB processing. LPKF presents a compact UV laser system, the MicroLine 1000 E. This unit is capable of cutting both coverlayers and flex-circuits as well as depanelling. The system is the most affordable system for laser PCB processing in the market and comes complete with simple-to-use high performance system software.

The third LPKF world premiere concerns a brand-new system for laser direct structuring of 3-D circuit boards. The MicroLine Fusion3D marks LPKF’s reduction of cycle times for the structuring of MID components by a factor of four. So that loading can match the speed of the laser heads, the system has to be fitted with two robots. The new LPKF Fusion3D offers the option of fitting up to four laser heads in seven positions. Laser structuring takes place on all sides simultaneously, positioning and feed times are waived.

“LPKF will continue to strengthen its position as world market leader in various segments of laser micromaterial processing. We will do this by demonstrating our continued commitment to the further development of our systems and processes,” promised Mr Bretthauer in the run-up to this year’s productronica.
The LPKF Fusion3D reduces cycle times for MID production by up to 75 percent
The LPKF Fusion3D reduces cycle times for MID production by up to 75 percent / HighRes
The LPKF Microline 1000E is able to cut coverlayers or to separate flexible PCBs
Small, fast, cheap: The LPKF Microline 1000E is able to cut coverlayers or to separate flexible PCBs / HighRes
The SMD stencil printing system LPKF ProtoPrint E
Inexpensive to professional boards: LPKF ProtoPrint E as a representati-ve of the new SMD-Series / HighRes


Notes to editors

LPKF will present the innovations on Nov. 11th 2009 at the productronica press conference in room B13 from 13:00 to 14:00 clock. We look forward to welcoming you.

Brief summary:

  • LPKF Laser & Electronics AG is showcasing in hall B3, stand 105
  • New generation SMT equipment
  • New: LPKF MicroLine 1000 E: UV laser system for depanelling based on proven ProMat series.
  • New: SMT E line (E = Economic or Education)
  • New: LPKF MicroLine Fusion3D – MID structuring from up to four positions simultaneously.

About LPKF

LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
 
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