LPKF Introduces Laser Direct Structuring System Fusion3D
The part is made of LDS-doped thermoplastic in 1-shot injection molding. Followed by the laser process; a laser beam writes the circuitry on the component. The metallization of these structures takes place in an electroless plating process. Afterwards the three-dimensional circuit carriers can be assembled.
The latest laser system LPKF Fusion3D addresses the demand for higher throughput and lower costs per unit. On a stable an precisely manufactured granite base, up to four laser sources can be mounted in seven positions to fit any LDS component without additional need for positioning. The structuring time is reduced by up to 75 percent.
"In the time and cost sensitive antenna-production industry, the LDS method already reduces initial costs substantially and gains valuable time in the design and start-up phase. The LPKF Fusion3D works with mass production to replace the inflexible tool-based production methods like insert molding or two-component injection molding", LPKF Vice President Nils Heininger describes the strategic direction of the innovative laser structuring system.
About LPKFLPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
Image authorLPKF Laser & Electronics AG
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