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PCB Processing on Laboratory Scale

07/Nov/2009
LPKF introduces new UV laser system MicroLine 1000 E for the stress-free separation of thin or flexible assembled and unassembled panels.
 
Components can be placed right to the edge of the cutting channel and even beyond when separation of single PCBs from the panel is made with non-contact UV laser technology. "The stress-free laser process does not affect either conductors or components near the cutting channel. This way a PCB can consist of more single boards and the assembly density can be significantly increased at the same time,” LPKF Business Area Manager Nils Heininger describes the advantages of the procedure. The laser process provides very precise, burr-free edges, even on complex contours.

To begin work on a new application it is sufficient to simply change the data through LPKF’s user-friendly system software; which imports data directly from popular layout programs.

At the Productronica Fair in Munich, LPKF will present the MicroLine 1000 E as an affordable entry-level system that can handle boards up to 229 x 305 mm (9” x 12”) in size. The integrated vacuum table holds the boards securely in position, with no need for further clamping devices; an advantage over conventional laser separation techniques for thin and flexible substrates.
LPKF MicroLine 1000E
LPKF MicroLine 1000E
LPKF MicroLine 1000E
Processing area of the LPKF MicroLine 1000E


"The LPKF MicroLine 1000 E is designed to complement the newly developed industrial systems MicroLine 6000 P and MicroLine 6000 S. The system is especially useful for applications with smaller boards and is a modest, compact partner also for demanding PCB processing," adds Heininger.

About LPKF

LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
 
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