LPKF introduces new systems and methods at Electronica 2010
“The innovations of recent years have seen LPKF through the economic crisis. The newly introduced developments have the potential to turn around the manufacturing processes in various fields.” notes Dr. Ingo Bretthauer, CEO at LPKF Laser & Electronics AG. He invites interested parties to booth 319 in exhibition hall B1.
StencilLasers introduced laser machining of micromaterials in the 90’s. During Electronica LPKF is showcasing the StencilLaser G 6080. This system is the first to achieve inspection cuts during the cutting process; without requiring additional time. The LPKF StencilLaser and the associated software now provide an optimization in production where every element of the stencil can be assigned separate quality standards: at lower standards edge perforations with the laser really moves into gear, achieving noteworthy performance. The process optimization also includes the control of cutting gasses and alternate between compressed air and industrial gasses as required by the process.
The MicroLine laser cutting systems are growing as well. The LPKF MicroLine 1000 P, a compact UV laser, is intended for industrial applications of cutting flexible substrates with high precision. A special vision tool combines two position recognition systems; increasing the bulk even with complex input geometries.
About LPKFLPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
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