LPKF introduces the ProtoLaser U3, a universal tool for printed board processing
On laminated materials such as FR4, distances and lines of 30/70 µm can still be created without damaging the sensitive substrate. For this structuring, LPKF includes a special hood for the laser processing head.
This compact and affordable system maintains many of the easy to use features as its predecessors. The ProtoLaser U3 is designed with casters so that it can be easily moved form one lab to another. It also requires only one power connection, a dust extraction unit and compressed air if working with laminated substrates. This system will be available from the 1st quarter of 2012.
One system, many materials, the LPKF ProtoLaser U3 can cut ceramic or LTCC, and structures sensitive ceramic substrates.
About LPKFLPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
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