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LPKF introduces the ProtoLaser U3, a universal tool for printed board processing

18/Nov/2011
LPKF ProtoLaser S and ProtoLaser U have established a solid foundation in the development laboratory. The ProtoLaser S specializes in structuring laminated substrates while ProtoLaser U is able to process and cut a variety of material.
 
Compact and capable, the new ProtoLaser U3 can also structure laminated substrates.
Recently introduced at the 2011 Productronica trade fair, the LPKF ProtoLaser U3 combines the capabilities of both ProtoLaser systems into one universal tool. It has the ability to cut and structure rigid and flexible printed board material, ceramic and TCO/ITO components. It can also create highly precise structures of 25/50 µm (distance / line width) on AL2O3 with gold coating while maintaining geometries that precisely follow the original layouts. 

On laminated materials such as FR4, distances and lines of 30/70 µm can still be created without damaging the sensitive substrate. For this structuring, LPKF includes a special hood for the laser processing head.


This compact and affordable system maintains many of the easy to use features as its predecessors. The ProtoLaser U3 is designed with casters so that it can be easily moved form one lab to another. It also requires only one power connection, a dust extraction unit and compressed air if working with laminated substrates. This system will be available from the 1st quarter of 2012.



One system, many materials, the LPKF ProtoLaser U3 can cut ceramic or LTCC, and structures sensitive ceramic substrates.

About LPKF

LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.
 
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