Garbsen, March 2008 – The LPKF-LDS Method produces electronic circuits directly on three-dimensional injection-moulded plastic parts. The laser process allows fast and flexible design changes, and can produce more precise structures than conventional MID techniques.了解更多...
Erlangen, 26 February 2008 – The new turnkey system LQ-Axis extends LPKF’s existing spectrum of standard laser plastic welding systems. The laser welding system is designed to specifically meet the requirements of contour welding of 2D micro and macro-modules. Moreover, it can be well used for the patented hybrid welding technology.了解更多...
Garbsen, 30 January 2008 – LPKF Laser & Electronics AG has strengthened their presence in Laser Plastic Welding and MID in the US market by establishing a new sales office in Detroit, MI. Chris Korson, Business Development Manager, will oversee the office.了解更多...
Garbsen/Germany, 21 January 2008 – The Board of Managing Directors of LPKF Laser & Electronics AG has appointed Lars Ederleh as new Managing Director of its subsidiary LaserMicronics GmbH with immediate effect. Ederleh has run the operative business of LaserMicronics since May 2005. The 34 year-old graduate engineer follows Kai Bentz, who was appointed to the Board of LPKF Laser & Electronics AG in October 2007.了解更多...
Garbsen, July 2008 – The LPKF StencilCheck Software inspects SMT stencils for cleanliness to verify that each aperture is free of debris. Only an absolutely clean stencil ensures an entire and reliable paste release when printing. The inspection of the cleaning result saves time for test printings and is more reliable than a visual inspection.了解更多...
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