Tomorrow's
Technology Today

LPKF is a leading supplier of high-volume laser processing solutions for advanced semiconductor packaging, industrial manufacturing, and rapid PCB prototyping.

Your Innovation Partner for Precision Laser Technology

We deliver solutions for semiconductor packaging, electronics and PCB manufacturing, plastic welding, and solar module scribing. High-performance systems from R&D to high-volume production — pioneers in precision laser and glass processing redefining industry standards for production-ready solutions.
半导体解决方案

专为先进封装、光电共封装以及玻璃面板技术的量产制造工艺而设计。专为先进封装、光电共封装以及玻璃面板技术的量产制造工艺而设计。
 

精密玻璃加工 (LIDE – 激光诱导深度蚀刻)


玻璃通孔 (TGV)

Industrial Manufacturing Solutions

More than 50 years of experience in innovation and laser manufacturing contribute to the development of the most powerful, precise, and efficient solutions on the market.
 

PCB Laser Depaneling
 

SMT Stencil Laser​
 

Laser Plastic Welding
 

Laser Transfer Printing
 

Laser Scribing

研发与实验室样品PCB快速制作

提供从创新设计到样品实物的实验室PCB快速制作与微材料精密加工解决方案,加速研发人员创新成果转化。
 

PCB样品制作


多层板解决方案


微材料加工


3D展厅
 

Discover Our Solutions -- Focus Websites

LPKF as Your Contract Manufacturing Service Partner

Beyond Technology - Grow with LPKF

LPKF 投资者关系
LPKF集团

前沿技术引领电子产业新变革

工作&职业规化

欢迎您成为我们团队中的一员。

LPKF 售后服务&技术支持
售后服务&技术支持

LPKF为全球客户提供技术服务保障。

资讯&新闻

新闻发布
市场活动
2026年3月11日至13日,全球嵌入式系统顶级盛会——embedded world 2026在德国纽伦堡隆重举行。在这场汇聚行业前沿科技与创新思维的舞台上,LPKF以“精准、高效、可持续”为主题,在2号展厅2-100号展位大放异彩,向全球研发人员展示了从线路图形到成品PCB的全流程实验室解决方案。
LPKF SolarQuipment GmbH, the leading provider of laser systems for the photovoltaic industry, announced the launch of Allegro® Essential, an
市面上大多TGV激光钻孔采用高能量激光直接烧蚀玻璃,属于“消融”工艺,虽能成孔,但热效应易导致孔壁微裂纹、碎屑残留,影响玻璃强度与电学性能,难以满足先进封装的严苛要求。